Spotnana Technology, Inc., headquartered in New York, NY, appears in the available FY2024-FY2026 LCA dataset with 7 filing records, a limited sponsorship-filing pattern among U.S. employers tracked here. The employer's median filed base wage is $230,000, with a P25 to P75 band of $190,000 to $230,000, useful as a public anchor when comparing offers or peer salaries. Spotnana Technology, Inc. is also matched with 2 PERM filings in the available FY2024-FY2025 PERM dataset, a descriptive filing pattern rather than an individual green-card outcome. These are public LCA filings, not visa approvals, hires, or open roles, and the figures generally exclude equity, bonus, and benefits.
No elevated signal appears in the currently matched LCA and USCIS datasets. This is descriptive filing history, not immigration, legal, or employment advice.
Spotnana Technology, Inc. has 7 H-1B LCA filing records in FY2024-FY2026.
The median filed base wage is about 132% of the industry baseline used by H1B Atlas.
2 PERM filings are matched to this employer; this is not a green-card success rate.
Spotnana Technology, Inc. shows limited H-1B LCA filing activity in the available FY2024-FY2026 dataset, with 7 public LCA records. The largest filed role clusters include Senior Software Engineer, Director of Product, and Senior Product Manager. Major worksite filing activity appears in Palo Alto, CA and New York, NY. These records are not final visa approvals, hires, or open roles.
The median filed base wage for this employer is $230,000. This figure comes from public LCA wage fields and generally excludes equity, bonus, benefits, and later compensation changes.
Spotnana Technology, Inc. has 2 matched PERM filings in the available FY2024-FY2025 dataset. The PERM-to-H-1B Filing Ratio is 29%, meaning PERM filings divided by H-1B LCA filings in the available public datasets; it is descriptive filing activity, not an individual green-card success rate.
Annual LCA filings across the available fiscal years.
Quartile breakdown of filed annual base wages.