Engineer II, Software Analysis Engineering
SOC Code: 17-2072.00
SOC Category: Electronics Engineers, Except Computer
LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023
Macro Wage Baseline (BLS OEWS May 2023)
+21.1%
Filed H-1B base wages show $139,464 vs BLS national median $115,210
Median Salary
$139,464
H-1B LCA Filings
5LCA records
Top 10% Salary
N/A
Data caveat
Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally use the lower bound of filed wage ranges and exclude equity, bonus, and benefits.
Salary Distribution (Base)
Distribution is not available for this page because the source filings do not include enough complete salary observations.
Top Sponsoring Employers
- Samsung Electronics America, Inc.5 filings$139,464
Highest Paying Cities
- Plano, TX5 filings$139,464
Frequently Asked Questions
- What is the average H1B salary for a Engineer II, Software Analysis Engineering?
- The median filed base salary for Engineer II, Software Analysis Engineering H-1B LCA records is $139,464 per year.
- How many Engineer II, Software Analysis Engineering H-1B LCA filings are in this dataset?
- There are 5 Labor Condition Applications filed for the Engineer II, Software Analysis Engineering role in the available dataset.
- Which employers file H-1B LCAs for Engineer II, Software Analysis Engineering?
- Top employers filing LCAs for Engineer II, Software Analysis Engineering include: Samsung Electronics America, Inc..