What is the average H1B salary for a Firmware Engineering?

The median filed base salary for Firmware Engineering H-1B LCA records is $213,600 per year.

How many Firmware Engineering H-1B LCA filings are in this dataset?

There are 18 Labor Condition Applications filed for the Firmware Engineering role in the available dataset.

Which employers file H-1B LCAs for Firmware Engineering?

Top employers filing LCAs for Firmware Engineering include Microsoft Corporation.

Firmware Engineering

SOC Code: 15-1252.00

SOC Category: Software Developers

LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023

Macro Wage Baseline (BLS OEWS May 2023)

+61.5%

Filed H-1B base wages show $213,600 vs BLS national median $132,270

Median Salary

$213,600

H-1B LCA Filings

18LCA records

Top 10% Salary

N/A

Data caveat

Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally use the lower bound of filed wage ranges and exclude equity, bonus, and benefits.

Salary Distribution (Base)

Distribution is not available for this page because the source filings do not include enough complete salary observations.

Top Sponsoring Employers

Microsoft Corporation18 filings
$213,600

Highest Paying Cities

Mountain View, CA9 filings
$201,226
Redmond, WA8 filings
N/A
Austin, TX1 filings
N/A

Frequently Asked Questions

What is the average H1B salary for a Firmware Engineering?: The median filed base salary for Firmware Engineering H-1B LCA records is $213,600 per year.
How many Firmware Engineering H-1B LCA filings are in this dataset?: There are 18 Labor Condition Applications filed for the Firmware Engineering role in the available dataset.
Which employers file H-1B LCAs for Firmware Engineering?: Top employers filing LCAs for Firmware Engineering include: Microsoft Corporation.