Hardware Development Engineer
SOC Code: 17-2131.00
SOC Category: Materials Engineers
LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023
Median Salary
$163,836
H-1B LCA Filings
21LCA records
Top 10% Salary
$190,000
Data caveat
Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally use the lower bound of filed wage ranges and exclude equity, bonus, and benefits.
Salary Distribution (Base)
$163,836
P25: $144,664
P75: $177,000
Min: $137,744Max: $190,000
Top Sponsoring Employers
- Apple Inc.19 filings$163,836
- Amazon.com Services LLC1 filings$140,000
- IBM Corporation1 filingsN/A
Highest Paying Cities
- Santa Clara, CA2 filings$177,555
- Cupertino, CA13 filings$162,589
- Austin, TX2 filings$160,000
- San Diego, CA2 filings$156,594
- Seattle, WA1 filings$140,000
- Yorktown Heights, NY1 filingsN/A
Frequently Asked Questions
- What is the average H1B salary for a Hardware Development Engineer?
- The median filed base salary for Hardware Development Engineer H-1B LCA records is $163,836 per year.
- How many Hardware Development Engineer H-1B LCA filings are in this dataset?
- There are 21 Labor Condition Applications filed for the Hardware Development Engineer role in the available dataset.
- Which employers file H-1B LCAs for Hardware Development Engineer?
- Top employers filing LCAs for Hardware Development Engineer include: Apple Inc., Amazon.com Services LLC, IBM Corporation.