Principal Engineer, Firmware Engineering
SOC Code: 17-2072.00
SOC Category: Electronics Engineers, Except Computer
LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023
Macro Wage Baseline (BLS OEWS May 2023)
+31.1%
Filed H-1B base wages show $151,091 vs BLS national median $115,210
Median Salary
$151,091
H-1B LCA Filings
6LCA records
Top 10% Salary
$160,638
Data caveat
Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally exclude equity, bonus, and benefits.
Salary Distribution (Base)
$151,091
P25: $150,470
P75: $151,091
Min: $150,470Max: $160,638
Top Sponsoring Employers
- Western Digital Technologies, Inc.6 filings$151,091
Highest Paying Cities
- Roseville, CA1 filings$160,638
- Laguna Niguel, CA1 filings$160,638
- Fremont, CA1 filings$151,091
- Milpitas, CA1 filings$151,091
- Irvine, CA2 filings$150,470
Frequently Asked Questions
- What is the average H1B salary for a Principal Engineer, Firmware Engineering?
- The median filed base salary for Principal Engineer, Firmware Engineering H-1B LCA records is $151,091 per year.
- How many Principal Engineer, Firmware Engineering H-1B LCA filings are in this dataset?
- There are 6 Labor Condition Applications filed for the Principal Engineer, Firmware Engineering role in the available dataset.
- Which employers file H-1B LCAs for Principal Engineer, Firmware Engineering?
- Top employers filing LCAs for Principal Engineer, Firmware Engineering include: Western Digital Technologies, Inc..