H1B Atlas

Principal Firmware Engineer

SOC Code: 17-2071.00
SOC Category: Electrical Engineers

LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023

Macro Wage Baseline (BLS OEWS May 2023)

+101.8%
Filed H-1B base wages show $220,000 vs BLS national median $109,010

Median Salary

$220,000

H-1B LCA Filings

5LCA records

Top 10% Salary

$225,000

Data caveat

Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally use the lower bound of filed wage ranges and exclude equity, bonus, and benefits.

Salary Distribution (Base)

$220,000
P25: $184,662
P75: $225,000
Min: $170,718Max: $225,000

Top Sponsoring Employers

Highest Paying Cities

Frequently Asked Questions

What is the average H1B salary for a Principal Firmware Engineer?
The median filed base salary for Principal Firmware Engineer H-1B LCA records is $220,000 per year.
How many Principal Firmware Engineer H-1B LCA filings are in this dataset?
There are 5 Labor Condition Applications filed for the Principal Firmware Engineer role in the available dataset.
Which employers file H-1B LCAs for Principal Firmware Engineer?
Top employers filing LCAs for Principal Firmware Engineer include: Astera Labs INC, Micron Technology, Inc., CYPRESS SEMICONDUCTOR CORPORATION.