H1B Atlas

R&D Engineer IC Design

SOC Code: 17-2072.00
SOC Category: Electronics Engineers, Except Computer

LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023

Macro Wage Baseline (BLS OEWS May 2023)

+77.9%
Filed H-1B base wages show $204,901 vs BLS national median $115,210

Median Salary

$204,901

H-1B LCA Filings

36LCA records

Top 10% Salary

N/A

Data caveat

Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally exclude equity, bonus, and benefits.

Salary Distribution (Base)

Distribution is not available for this page because the source filings do not include enough complete salary observations.

Top Sponsoring Employers

Highest Paying Cities

Frequently Asked Questions

What is the average H1B salary for a R&D Engineer IC Design?
The median filed base salary for R&D Engineer IC Design H-1B LCA records is $204,901 per year.
How many R&D Engineer IC Design H-1B LCA filings are in this dataset?
There are 36 Labor Condition Applications filed for the R&D Engineer IC Design role in the available dataset.
Which employers file H-1B LCAs for R&D Engineer IC Design?
Top employers filing LCAs for R&D Engineer IC Design include: Broadcom Corporation, LSI Corporation, Avago Technologies US Inc..